ASE Global
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ShareCopied to clipboardASE Global is a company. It is a public company in Kaohsiung. It was founded in 1983 and its current CEO is Hung-Pen Chang. It is part of the Information Technology sector, specifically in the Semiconductors & Semiconductor Equipment industry.
Key facts
- city: Kaohsiung
- employees: 95,492 people
- revenues: 18.1B $
- company type: public
- sector: Information Technology
- industry: Semiconductors & Semiconductor Equipment
- foundation year: 1983
- CEO: Hung-Pen Chang
- CEO approval: 74 %
- ESG score: Try Pro to see estimate
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ASE Global is one of the companies in Semiconductors & Semiconductor Equipment, companies in Information Technology, companies in Kaohsiung and 3,456,808 companies in our database.
Talking Points
- About ASE Technology Holding, Co., Ltd.
- ASE Technology Holding Co (ASEH) combines the strengths and expertise of Advanced Semiconductor Engineering (ASE), Inc., Siliconware Precision Industries Co.,Ltd.(SPIL) and USI Inc. (USI) to create valuable synergy that benefits the semiconductor industry.
- Packaging chips (not the 🍟 kind) since 1984 +🏆DJSI since2016 *CDP Water/Climate Leader #HeterogeneousIntegration #SysteminPackage #3DIC #FanoutWLP
- Leading provider of advanced semiconductor packaging & test. Member of ASE Technology Holdings. NYSE:ASX TWSE:3711 | ASE (Advanced Semiconductor Engineering, Inc), a member of ASE Technology Holdings (NYSE:ASX) is one of the world's largest providers of outsourced semiconductor manufacturing services in assembly and test (OSAT), and, a leading ...
- ASE Technology Holding Co., Ltd. provides a range of semiconductors packaging and testing, and electronic manufacturing services in the United States, Taiwan, rest of Asia, Europe, and internationally. It offers packaging services, including flip chip ball grid array (BGA) and chip scale package (CSP), advanced chip scale packages, quad flat packages, low profile and thin quad flat packages, bump chip carrier and quad flat no-lead (QFN) packages, advanced QFN packages, plastic BGAs, and 3D chip packages; stacked die solutions in various packages; and copper and silver wire bonding solutions. The company also provides advanced packages, such as flip chip BGA; heat-spreader FCBGA; flip-chip CSP; hybrid FCCSP; flip chip package in package and package on package (POP); advanced single sided substrate; high-bandwidth POP; fan-out wafer-level packaging; SESUB; and 2.5D silicon interposer. In addition, it offers IC wire bonding packages; system-in-package products (SiP) and modules; and interconnect materials, as well as assembles automotive electronic products. Further, the company provides a range of semiconductor testing services, including front-end engineering testing, wafer probing, logic/mixed-signal/RF module and SiP/MEMS/discrete final testing, and other test-related services, as well as drop shipment services. Additionally, it develops, constructs, sells, leases, and manages real estate properties; produces substrates; offers information software, equipment leasing, investment advisory, and warehousing management services; processes and sells computer and communication peripherals, electronic components, telecommunications equipment, and motherboards; and imports and exports goods and technology. The company was incorporated in 1984 and is headquartered in Kaohsiung, Taiwan.
- ASE
- ASE is the world’s leading provider of independent semiconductor manufacturing services in assembly and test. ASE develops and offers complete turnkey solutions covering IC packaging, design and production of interconnect materials, front-end engineering test, wafer probing and final test.