Amkor
ShareCopied to clipboardAmkor is a company. It is a public company in Tempe, the United States. It was founded in 1968 and its current CEO is Guillaume Marie Jean Rutten. It is part of the Information Technology sector, specifically in the Semiconductors & Semiconductor Equipment industry.
Key facts
- city: Tempe
- country: United States
- employees: 28,300 people
- revenues: 6.3B $
- company type: public
- sector: Information Technology
- industry: Semiconductors & Semiconductor Equipment
- foundation year: 1968
- CEO: Guillaume Marie Jean Rutten
- CEO approval: 74 %
- ESG score: 79.73 / 100
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Amkor is one of the companies in the United States, companies in Semiconductors & Semiconductor Equipment, companies in Information Technology, companies in Tempe and 3,456,808 companies in our database.
Talking Points
- Amkor TechnologySemiconductor IC Packaging, Design & Test Services
- Amkor Technology, Inc. is one of the world’s largest providers of outsourced (OSAT) semiconductor packaging, design, and test services.
- Amkor provides #semiconductor design, assembly & test services. We offer advanced innovations in Wafer-Level Flip Chip, #MEMS, #SiP and AiP/AoP Packaging. $amkr
- Since 1968, Amkor has delivered innovative IC packaging solutions with the service & capacity global customers rely on. | Amkor Technology is one of the world's largest providers of outsourced semiconductor packaging and test services. Founded in 1968, Amkor pioneered the outsourcing of IC packaging and test and is now a strategic ...
- Amkor Technology, Inc. provides outsourced semiconductor packaging and test services in the United States, Japan, Europe, the Middle East, Africa, and the rest of the Asia Pacific. It offers turnkey packaging and test services, including semiconductor wafer bump, wafer probe, wafer back-grind, package design, packaging, and test and drop shipment services. The company also provides flip chip-scale package products for use in smartphones, tablets, and other mobile consumer electronic devices; flip-chip stacked chip-scale packages that are used to stack memory on top of digital baseband, and as applications processors in mobile devices; and flip-chip ball grid array packages for various networking, storage, computing, and consumer applications. In addition, it offers wafer-level CSP packages that are used in power management, transceivers, sensors, wireless charging, codecs, radar, and specialty silicon; wafer-level fan-out packages for use in ICs; and silicon wafer integrated fan-out technology, which replaces a laminate substrate with a thinner structure. Further, the company provides lead frame packages that are used in electronic devices for low to medium pin count analog and mixed-signal applications; substrate-based wirebond packages, which are used to connect a die to a substrate; micro-electro-mechanical systems (MEMS) packages that are miniaturized mechanical and electromechanical devices; and advanced system-in-package modules, which are used in radio frequency and front end modules, basebands, connectivity, fingerprint sensors, display and touch screen drivers, sensors and MEMS, and NAND memory and solid-state drives. It primarily serves integrated device manufacturers, fabless semiconductor companies, original equipment manufacturers, and contract foundries. Amkor Technology, Inc. was founded in 1968 and is headquartered in Tempe, Arizona.