Avoiding inelastic strains in solder joint interconnections of IC devices
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ShareCopied to clipboardAvoiding inelastic strains in solder joint interconnections of IC devices is a book. It was written by Ephraim Suhir and published by Taylor&Francis in 2020.
Key facts
- author: Ephraim Suhir
- publication date: 2020
- book publisher: Taylor&Francis
- book series: unknown
- book subjects: Failure analysis (Engineering)
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"Avoiding inelastic strains in solder joint interconnections of IC devices" is one of the books by Ephraim Suhir, books by Taylor&Francis and 2,617,384 books in our database.
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