Microelectronic packaging
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ShareCopied to clipboardMicroelectronic packaging is a book subject. It includes 30 books, written by 17 different authors.
Key facts
- number of authors: 17 people
- number of books: 30
- books: 3D IC integration and packaging, Advanced packaging and manufacturing technology based on adhesion engineering : wafer-level transfer packaging and fabrication techniques using interface energy control method, Area array packaging handbook
- authors: John H. Lau, Seonho Seok, Ken Gilleo
- publication dates: 2016, 2018, 2002
- book publishers: Mc Graw-Hill Education, Springer International Publishing, Mc Graw-Hill
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"Microelectronic packaging" is one of the 293,135 book subjects in our database.
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This dashboard is based on data from: The British Library.
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