Electronic packaging-Reliability
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ShareCopied to clipboardElectronic packaging-Reliability is a book subject. It includes 3 books, written by 2 different authors.
Key facts
- number of authors: 2 people
- number of books: 3
- books: Guidebook for Managing Silicon Chip Reliability, Wire bonding in microelectronics, Wire bonding in microelectronics : materials, processes, reliability, and yield
- authors: Michael Pecht, George G. Harman
- publication dates: 2017, 2010, 1997
- book publishers: Taylor&Francis, Mc Graw-Hill
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"Electronic packaging-Reliability" is one of the 293,135 book subjects in our database.
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This dashboard is based on data from: The British Library.
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