Electronic packaging-Materials
Bookmark
ShareCopied to clipboardElectronic packaging-Materials is a book subject. It includes 4 books, written by 4 different authors.
Key facts
- number of authors: 4 people
- number of books: 4
- books: Advanced materials for thermal management of electronic packaging, Electronic packaging : materials and their properties, Multilayer ceramic substrate-technology for VLSI package/multichip module
- authors: Xingcun Colin Tong, Michael Pecht, Kanji Ōtsuka
- publication dates: 2011, 2017, 1993
- book publishers: : Springer, Taylor&Francis, Elsevier Applied Science
See more factsExtract data
Download datasets about Electronic packaging-Materials:
Dataset of books about Electronic packaging-Materials:
"Electronic packaging-Materials" is one of the 293,135 book subjects in our database.
Related
Connected or similar to Electronic packaging-Materials: .
This dashboard is based on data from: The British Library.
This content is available under the CC BY 4.0 license.