Electronic packaging and interconnection series
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ShareCopied to clipboardElectronic packaging and interconnection series is a book series. It includes 13 books, written by 13 different authors.
Key facts
- number of authors: 13 people
- number of books: 13
- books: Design guidelines for surface mount and fine pitch technology, Electronic failure analysis handbook : techniques and applications for electronic and electrical packages, components, and assemblies, Electronic packaging of high speed circuitry
- authors: Vern Solberg, Perry L. Martin, Stephen G. Konsowski
- publication dates: 1996, 1999, 1997
- book publishers: Mc Graw-Hill
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"Electronic packaging and interconnection series" is one of the 88,457 book series in our database.
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