Wirebonding in microelectronics packaging
ShareCopied to clipboardWirebonding in microelectronics packaging is a book. It was written by Rao R. Tummala and published by Chapman&Hall in 1998.
Key facts
- author: Rao R. Tummala
- publication date: 1998
- book publisher: Chapman&Hall
- book series: unknown
- book subjects: Microelectronic packaging
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"Wirebonding in microelectronics packaging" is one of the books by Rao R. Tummala, books by Chapman&Hall and 2,617,384 books in our database.
This dashboard is based on data from: The British Library.
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