Wire bonding in microelectronics : materials, processes, reliability, and yield
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ShareCopied to clipboardWire bonding in microelectronics : materials, processes, reliability, and yield is a book. It was written by George G. Harman and published by Mc Graw-Hill in 1997.
Key facts
- author: George G. Harman
- publication date: 1997
- book publisher: Mc Graw-Hill
- book series: Electronic packaging and interconnection series
- book subjects: Microelectronics, Semiconductors-Failures, Electronic packaging-Reliability
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"Wire bonding in microelectronics : materials, processes, reliability, and yield" is one of the books by George G. Harman, books by Mc Graw-Hill and 2,617,384 books in our database.
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