Multilayer ceramic substrate-technology for VLSI package/multichip module
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ShareCopied to clipboardMultilayer ceramic substrate-technology for VLSI package/multichip module is a book. It was written by Kanji Ōtsuka and published by Elsevier Applied Science in 1993.
Key facts
- author: Kanji Ōtsuka
- publication date: 1993
- book publisher: Elsevier Applied Science
- book series: unknown
- book subjects: Integrated circuits, Very large scale integration-Design and construction, Electronic ceramics, Aluminum oxide
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"Multilayer ceramic substrate-technology for VLSI package/multichip module" is one of the books by Kanji Ōtsuka, books by Elsevier Applied Science and 2,617,384 books in our database.
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