Integrated modeling of chemical mechanical planarization for sub-micron IC fabrication : from particle scale to feature, die and wafer scales
Bookmark
ShareCopied to clipboardIntegrated modeling of chemical mechanical planarization for sub-micron IC fabrication : from particle scale to feature, die and wafer scales is a book. It was written by Jianfeng Luo and published by : Springer in 2004.
Key facts
- author: Jianfeng Luo
- publication date: 2004
- book publisher: : Springer
- book series: unknown
- book subjects: Integrated circuits-Design and construction, Integrated circuits-Design and construction-Simulation methods
See more factsExtract data
Download datasets about Integrated modeling of chemical mechanical planarization for sub-micron IC fabrication : from particle scale to feature, die and wafer scales:
Dataset of books series that contain Integrated modeling of chemical mechanical planarization for sub-micron IC fabrication : from particle scale to feature, die and wafer scales:
Dataset of book subjects that contain Integrated modeling of chemical mechanical planarization for sub-micron IC fabrication : from particle scale to feature, die and wafer scales:
"Integrated modeling of chemical mechanical planarization for sub-micron IC fabrication : from particle scale to feature, die and wafer scales" is one of the books by Jianfeng Luo, books by : Springer and 2,617,384 books in our database.
Related
Connected or similar to Integrated modeling of chemical mechanical planarization for sub-micron IC fabrication : from particle scale to feature, die and wafer scales: .
This dashboard is based on data from: The British Library.
This content is available under the CC BY 4.0 license.