Electrical modeling and design for 3D system integration : 3D integrated circuits and packaging, signal integrity, power integrity and EMC
ShareCopied to clipboardElectrical modeling and design for 3D system integration : 3D integrated circuits and packaging, signal integrity, power integrity and EMC is a book. It was written by Er-Ping Li and published by Wiley in 2012.
Key facts
- author: Er-Ping Li
- publication date: 2012
- book publisher: Wiley
- book series: unknown
- book subjects: Electromagnetic devices-Mathematical models
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"Electrical modeling and design for 3D system integration : 3D integrated circuits and packaging, signal integrity, power integrity and EMC" is one of the books by Er-Ping Li, books by Wiley and 2,617,384 books in our database.
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