Advanced packaging and manufacturing technology based on adhesion engineering : wafer-level transfer packaging and fabrication techniques using interface energy control method
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ShareCopied to clipboardAdvanced packaging and manufacturing technology based on adhesion engineering : wafer-level transfer packaging and fabrication techniques using interface energy control method is a book. It was written by Seonho Seok and published by Springer International Publishing in 2018.
Key facts
- author: Seonho Seok
- publication date: 2018
- book publisher: Springer International Publishing
- book series: unknown
- book subjects: Manufactures, Engineering, Nanotechnology
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"Advanced packaging and manufacturing technology based on adhesion engineering : wafer-level transfer packaging and fabrication techniques using interface energy control method" is one of the books by Seonho Seok, books by Springer International Publishing and 2,617,384 books in our database.
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