Advanced materials for thermal management of electronic packaging
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ShareCopied to clipboardAdvanced materials for thermal management of electronic packaging is a book. It was written by Xingcun Colin Tong and published by : Springer in 2011.
Key facts
- author: Xingcun Colin Tong
- publication date: 2011
- book publisher: : Springer
- book series: Springer series in advanced microelectronics
- book subjects: Electronic packaging-Materials, Electronic apparatus and appliances-Temperature control
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"Advanced materials for thermal management of electronic packaging" is one of the books by Xingcun Colin Tong, books by : Springer and 2,617,384 books in our database.
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