Advanced liquid metal cooling for chip, device and system
Bookmark
ShareCopied to clipboardAdvanced liquid metal cooling for chip, device and system is a book. It was written by Jing Liu and published by World Scientific in 2022.
Key facts
- author: Jing Liu
- publication date: 2022
- book publisher: World Scientific
- book series: unknown
- book subjects: Liquid metals-Thermal properties, Heat exchangers, Electronic apparatus and appliances-Cooling
See more factsExtract data
Download datasets about Advanced liquid metal cooling for chip, device and system:
Dataset of books series that contain Advanced liquid metal cooling for chip, device and system:
Dataset of book subjects that contain Advanced liquid metal cooling for chip, device and system:
"Advanced liquid metal cooling for chip, device and system" is one of the books by Jing Liu, books by World Scientific and 2,617,384 books in our database.
Related
Connected or similar to Advanced liquid metal cooling for chip, device and system: .
This dashboard is based on data from: The British Library.
This content is available under the CC BY 4.0 license.