3D IC integration and packaging
ShareCopied to clipboard3D IC integration and packaging is a book. It was written by John H. Lau and published by Mc Graw-Hill Education in 2016.
Key facts
- author: John H. Lau
- publication date: 2016
- book publisher: Mc Graw-Hill Education
- book series: unknown
- book subjects: Microelectronic packaging, Three-dimensional integrated circuits
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"3D IC integration and packaging" is one of the books by John H. Lau, books by Mc Graw-Hill Education and 2,617,384 books in our database.
This dashboard is based on data from: The British Library.
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