3D IC and RF SiPs : advanced stacking and planar solutions for 5G mobility
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ShareCopied to clipboard3D IC and RF SiPs : advanced stacking and planar solutions for 5G mobility is a book. It was written by Lih-Tyng Hwang and published by Wiley-IEEE Press in 2018.
Key facts
- author: Lih-Tyng Hwang
- publication date: 2018
- book publisher: Wiley-IEEE Press
- book series: unknown
- book subjects: Mobile communication systems-Technological innovations
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"3D IC and RF SiPs : advanced stacking and planar solutions for 5G mobility" is one of the books by Lih-Tyng Hwang, books by Wiley-IEEE Press and 2,617,384 books in our database.
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